Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
Recent advancements in AI and more specifically large language models such as ChatGPT have put a strain on data centers. AI models require huge amounts of data to train, and in order to move data ...
SAN JOSE, Calif., March 13, 2026 /PRNewswire/ -- To overcome the thermal barriers limiting AI performance, Frore Systems today unveiled LiquidJet™ Nexus, a new integrated liquid cooling system ...
SAN JOSE, Calif., March 16, 2026 /PRNewswire/ -- Frore Systems today announced it has achieved Unicorn status following the close of a $143 million Series D financing round, bringing total capital ...
Engineers from the University of Newcastle have come up with a surprisingly simple new energy storage system, built around blocks that store thermal energy like melted chocolate chips in a muffin. The ...
Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...
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